Thermal Conductive Materials
Thermal Management for High-Performance Electronics
As electronic components become smaller and more powerful, managing heat is a critical design challenge. Increased placement density on PCBs (Printed Circuit Boards) leads to higher heat production, which can compromise performance and reliability.
To solve this, ELANTAS has developed a complete line of thermally conductive casting compounds and Thermal Interface Materials (TIMs). These Bectron® materials are designed to efficiently transfer heat away from sensitive components to a heat sink, ensuring optimal performance and long-term stability.
Efficient Heat Dissipation & Robust Protection
The ELANTAS Bectron® series of thermally conductive and electrically insulating materials are easy-flowing, self-leveling, and designed for high-volume production. In addition to providing excellent heat dissipation, these compounds also protect components from vibration, moisture, and corrosion.
Key Material Properties:
- Versatile Chemistries: We offer two-component (2K) Gap Fillers and Potting Materials based on advanced Silicone and Polyurethane chemistries.
- High-Temperature Stability: Engineered for a wide operational temperature range, typically from -50°C to +200°C.
- Mechanical Stress Relief: Flexible mechanical properties compensate for thermal expansion (CTE mismatch) and protect components from vibration and shock.
- Superior Electrical Insulation: Provides excellent dielectric strength while remaining thermally conductive.
- Safety & Compliance: Self-extinguishing (flame retardant) options are available to meet strict UL and industry safety standards.
Do you need further information about thermal conductive materials? Please get in touch with us.
